中文站  | English  
Netcom Products Solutions

Netcom Products Solutions

作者:admin    来源:未知    发布时间:2019-01-07 17:45    浏览量:

网通散热应用

 

网通产品种类

产品模型详情图

PRODUCT MODEL DETAIL DIAGRAM

Structure schematic diagram of wireless router

 

傲川-无线路由器结构示意图

Structure schematic diagram of wireless router

 

Icon1

傲川-无线路由器散热结构图

Icon2

傲川-无线路由器散热结构图

Schematic diagram of shell heat conduction

 

傲川-外壳热传导示意图

Portable WLAN Device Internal Structure Diagram

 

傲川-便携式WLAN设备内部结构图

Modem Internal Structure Diagram

 

傲川-Modem内部结构图

Temperature rise diagram

 

傲川-温升示意图

Router Temperature Rise Control

Indoor: under ambient temperature, the surface temperature of full-load operation is not more than 60 C; CPU temperature is not more than 80 C; over-temperature and frequency reduction.
 
 
 
Outdoor: test the surface temperature of full-load operation at ambient temperature 70 C-80 C; CPU maximum temperature 110-120 C, overtemperature and frequency reduction
 
 
 
Portable WLAN temperature rise: under normal temperature full load operation, equipment surface temperature does not exceed 55 C, CPU temperature does not exceed 65 C, temperature and frequency reduction.

Portable WLAN

 

傲川-便携式WLAN

产品应用场景

PRODUCT APPLICATION SCENARIOS

Selection of Main Heating Chip Power and Thermal Conductive Interface Material-Thermal Conductive Silicone Gasket

 

傲川-主要发热芯片功率及导热界面材料的选型

Heat source power Materials used Usage mode special requirements
1-2W/3-5W 导热硅胶垫片
导热系数1.2-2.5w/m.k 
厚度:0.25-1.0mm 
击穿电压:6kv
填充CPU、ADSL、无线模组与铝散热器之间的 空隙,将芯片热量传递到散热器,起到导热,减 震的作用。 因路由器/便携式WLAN涉及到有无线发射天线等 高频发射源,所以对垫片的要求需做到不影响电磁波。

Selection of Main Heating Chip Power and Thermal Conductive Interface Material-Thermal Conductive Silicone Gasket

 

傲川-主要发热芯片功率及导热界面材料的选型

热源功率 使用材料 使用方式 特殊要求
2-4W 导热硅胶垫片
导热系数1.5-2.5w/m.k 
厚度:0.5-1.0mm 
击穿电压:6kv
Modem模组内部解码芯片、主芯片和输出控制IC与铝 散热器之间的热传导、填充、减震。 因路由器/便携式WLAN涉及到有无线发射天线等 高频发射源,所以对垫片的要求需做到不影响电磁波。

Other Router Architecture

 

傲川-其他路由器结构

Other Router Architecture

 

傲川-交换机

Schematic diagram of switch structure

 

Icon1

傲川-交换机结构示意图

Icon2

傲川-交换机结构示意图

 

热源功率 使用材料 使用方式
1-2W/3-5W 导热硅胶垫片
导热系数1.0-1.5w/m.k 
厚度:0.25-1.0mm 
击穿电压:6kv
填充CPU、与铝散热器之间的空隙,将芯片热量传递到散热器,起到导热减震的作用。

网通类未来的发展趋势

THE FUTURE TREND OF NETCOM

Hardware and Functional Aspects - Intelligent Router

Intelligent routers are based on open systems and support application installation, such as network acceleration, wall-turning, advertising filtering, NFC, etc. Some intelligent routers are also equipped with large capacity hard disks or support external SD cards, which can be used as storage devices. In short, intelligent router has become a small computer. With the increase of product functions, the heat dissipation of equipment will become a very severe test for engineers (more heating components, more power consumption, compact structure) and the requirements for thermal conductive materials will become more and more diverse.

Network traffic growth

With the intelligent processing of electrical and electronic products, many electronic devices need to be operated and controlled through the network, so the working frequency and intensity of Netcom products are increased. The increase of network speed also brings power increase to Netcom products, and still brings higher demand for heat dissipation.

 

上一篇:没有了
下一篇:没有了

ONLINE :HOTLINE: 0755-27810161/83990270/27810721/83276348/83286865

EMAIL: sales@smartfan.com.cn

Wang Jing technology is a high-tech enterprise specializing in R D, production and marketing of cooling fan and cooling solution. Professional RD team, innovative technology and concepts, perfect test equipment, complete heat dissipation and mechanism simulation software, and collaborative customer ...

FRIENDSLINK: 旺景科技诚信通   
Copyright © 深圳市旺景科技有限公司 版权所有
DESIGN BY SJM
  备案号:粤ICP备09009970号