Chips are the collective name of semiconductor components. It is the carrier of integrated circuit, which is made up of wafers.
IC chip, referring to all electronic components, is a circuit module which integrates a variety of electronic components on the silicon board to achieve a specific function. It is the most important part of electronic equipment, which undertakes the functions of calculation and storage. The application scope of integrated circuits covers almost all electronic equipment in military and civil use.
Chipset is the core component of the motherboard. According to the different arrangement positions on the motherboard, it is usually divided into North Bridge Chip and South Bridge Chip.
With the rapid development of microelectronics technology, the size of the chip is getting smaller and smaller, and the calculation speed is getting faster and faster, and the calorific value is getting bigger and bigger, which puts forward higher requirements for the heat dissipation of the chip. Designers must adopt advanced heat dissipation technology and excellent heat dissipation materials to effectively remove heat and ensure that the chips work normally within the maximum temperature they can withstand.
As shown in Fig. 1, one of the most commonly used ways of heat dissipation is to use radiators, which are mounted on the chip with thermal conductive materials and tools, so that the heat generated by the chip can be quickly eliminated.
Because there are many ravines or voids between the bottom of the radiator and the surface of the chip, all of which are air. Because air is a bad conductor of heat, the air gap will seriously affect the efficiency of heat dissipation, so that the performance of the radiator is greatly reduced, or even unable to play a role. In order to reduce the gap between chip and radiator and increase the contact area, thermal conductive materials with good thermal conductivity must be used to fill, such as thermal conductive tape, thermal conductive gasket, thermal conductive silicone ester, thermal conductive adhesives, phase transition materials, etc. As shown in Figure 2, the heat emitted by the chip is transferred to the radiator through the heat conducting material, and then most of the heat is brought into the surrounding air by the way of convection (forced convection and natural convection) through the high-speed rotation of the fan. The heat is forcibly removed, thus forming a heat dissipation path from the chip, then through the radiator and heat conducting material, to the surrounding air.
With the increasing integration of IC chips, the requirement for heat transfer effect of thermal interface materials is also raised. Our company has developed professional thermal interface materials for IC chips heat dissipation.
BN-FS800 high thermal conductivity gasket, thermal conductivity of 8W/m,.K, high insulation, thickness of 1-3m m, can meet the thermal design of high heat dissipation requirements.
BN-G600 thermal conductive silicone grease, thermal conductivity of 5.5W/m.k, easy to smear, no solvent, no drying, with long-term reliability.
BNK10 thermal conductive silicone adhesive with thermal conductivity of 1.3W/m.k, thickness of 0.15m m and ultra-low heat
Resistance, high insulation strength, withstand voltage up to 5.5KV, can withstand screw torsion and pressure.
IC chip applications involve computer, television, automotive electronics, LED, switch, solar energy, medical, television, military and other fields.
